SMD to DIP SOIC 18 0.050" (1.27mm) FR4 Epoxy Glass
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DIP300-SOIC-18N

DigiKey Part Number
315-DIP300-SOIC-18N-ND
Manufacturer
Manufacturer Product Number
DIP300-SOIC-18N
Description
DIP-18 (0.3" WIDTH, 0.1" PITCH)
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
SMD to DIP SOIC 18 0.050" (1.27mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
-
Packaging
Bulk
Part Status
Active
Proto Board Type
SMD to DIP
Package Accepted
SOIC
Number of Positions
18
Pitch
0.050" (1.27mm)
Board Thickness
0.063" (1.60mm)
Material
FR4 Epoxy Glass
Size / Dimension
0.900" L x 0.400" W (22.86mm x 10.16mm)
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In-Stock: 43
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All prices are in EUR
Bulk
QuantityUnit PriceExt Price
110,06000 €10,06 €
58,70000 €43,50 €
108,21600 €82,16 €
257,65360 €191,34 €
507,27960 €363,98 €
1006,94470 €694,47 €
2506,55492 €1 638,73 €
5006,29528 €3 147,64 €
1 0006,06238 €6 062,38 €
Manufacturers Standard Package
Unit Price without VAT:10,06000 €
Unit Price with VAT:12,17260 €